리포트
[한국전자통신연구원] 4차 산업 혁명의 숨은 혁신 기술: 전자 패키징 기술
- 테크포럼
- 2017-12-06 22:59:15
- 서론: 4차 산업혁명과 전자 패키징 기술의 연관성
- 본론: 전자 패키징의 혁신 기술
- 결론
- 본론: 전자 패키징의 혁신 기술
- 결론
초록
Electronic packaging technology is a technology that easily connects devices to the outside. The fourth industrial revolution is thought to be possible with the advancement of certain devices. The advancement of these devices must be accompanied by innovations in electronic packaging that connects the devices to the outside world, allowing their performances to be implemented at the system level. In this paper, the development trends of 2.5D/3D technology, heterogeneous integration technology, ultrafine interconnection technology, and heat dissipation technology will be examined, and the development direction of these technologies will be discussed.
Electronic packaging technology is a technology that easily connects devices to the outside. The fourth industrial revolution is thought to be possible with the advancement of certain devices. The advancement of these devices must be accompanied by innovations in electronic packaging that connects the devices to the outside world, allowing their performances to be implemented at the system level. In this paper, the development trends of 2.5D/3D technology, heterogeneous integration technology, ultrafine interconnection technology, and heat dissipation technology will be examined, and the development direction of these technologies will be discussed.
