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[한국전자통신연구원] 다차원 이종 복합 디바이스 인터커넥션 기술 - 레이저 기반 접합 기술
테크포럼
2019-01-09 11:37:38

Ⅰ. 서론: 디바이스 인터커넥션 기술 
Ⅱ. 본론: 레이저 기반 접합 기술 
Ⅲ. 결론 

 

초록
As devices have evolved, traditional flip chip bonding and recently commercialized thermocompression bonding techniques have been limited. Laser-assisted bonding is attracting attention as a technology that satisfies both the requirements of mass production and the yield enhancement of advanced packaging interconnections, which are weak points of these bonding technologies. The laser-assisted bonding technique can be applied not only to a two-dimensional bonding but also to a three-dimensional stacked structure, and can be applied to various types of device bonding such as electronic devices; display devices, e.g., LEDs; and sensors.

 

 

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